Business Wire

TSMC and Cadence Collaborate to Deliver AI-Driven Advanced-Node Design Flows, Silicon-Proven IP and 3D-IC Solutions

SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that it is collaborating with TSMC to enhance productivity and optimize product performance for AI-driven ...
Nasdaq

Cadence Expands Collaboration with TSMC and Microsoft to Accelerate Timing Signoff for Giga-Scale Designs on the Cloud

Customers benefit from improved productivity and scalability with Cadence signoff solutions and TSMC technology on the Microsoft Azure cloud with the Cadence CloudBurst Platform Cadence Tempus Timing ...
Business Wire

Cadence Partners with TSMC to Power Next-Generation Innovations Using AI Flows and IP for TSMC Advanced Nodes and 3DFabric

SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence (Nasdaq: CDNS) today announced major advancements in chip design automation and IP, driven by its long-standing relationship with TSMC to develop advanced ...
Nasdaq

Cadence and TSMC Advance AI and 3D-IC Chip Design with Certified Design Solutions for TSMC’s A16 and N2P Process Technologies

Also announce tool certification for TSMC N3C process and initial collaboration on TSMC’s newest A14 technology SAN JOSE, Calif.--(BUSINESS WIRE)-- Cadence (Nasdaq: CDNS) today announced it is ...