As semiconductor devices become more complex, so do the methods for patterning them. Ever-smaller features at each new node require continuous advancements in photolithography techniques and ...

Several fab tool vendors are rolling out the next wave of self-aligned patterning technologies amid the shift toward new devices at 10/7nm and beyond. Applied Materials, Lam Research and TEL are ...

During a visit by President Barack Obama in February, Intel executives announced plans to build a new semiconductor facility in Chandler, Ariz. To cost more than $5 billion, the plant will be the most ...

Double patterning is a class of technologies developed for photolithography to enhance the feature density of computer chips. The resolution of a photoresist pattern begins to blur at around 45 nm ...

As semiconductor technology advanced from 65nm to 7nm over the last 10 years, new challenges have arisen in design and manufacturing. Securing the IC yield means developing new methods that respond to ...

IBM has devised materials and processes that could help improve the efficiency of chip production at the 7nm node and beyond. The company's researchers are working on challenges in the emerging field ...