Until recently, signal integrity has been a concern relegated predominantly to multi-gigabit serial interface design. Today, it is an aspect of design that engineers building high-speed parallel ...

Synopsys and Samsung Foundry are working together to meet these demands. And we’re delivering integrated solutions that help chip developers navigate several converging trends: AI and high-performance ...

Leading-edge chip desiLeading-edge chip design was never easy, but it’s getting harder all the time. Rapid advances in communication systems are driving data rates higher. With the emergence of ...

The semiconductor ceramic packaging materials market is set to expand from USD 1.85 billion in 2025 to USD 2.78 billion by ...

Placement of regulators for core voltage levels closer to the chips that need them Usage of unique materials like ECMs in PCBs and packages to provide power rail capacitance Package-level and ...

As every engineer learns at an early stage, clock edges must be obeyed. In the digital domain, synchronization through global and local clock trees, slew rate and rising/falling times all combine to ...

The most different aspect between a normal lamination structure and High-Density Fan-out (HDFO) is the routing scale. That aspect is also the challenge and focus of this study. At an HDFO scale, most ...

Samsung has developed a new chip packaging technology that could significantly improve the speed and power-efficiency of semiconductor chips. The new Interposer-Cube4 (I-Cube4) technology is the ...

No gadget in this episode, I thought instead I’d write about a book I purchased recently. It is Eric Bogatin’s “Signal and Power Integrity — Simplified” second edition. Like most of you, I’ve got a ...

For system-on-a-chip designs at 90 and 65 nm, dynamic noise greatly exacerbates the challenge of timing signoff. To accurately examine noise effects, designers need tools that provide an accurate ...

NewPhotonics Ltd, today unveiled the industry first NPG10240 3.2Tbps PIC with 448Gbps modulators, integrated lasers and OSPic™ optical signal processor. Designed for next-generation AI infrastructure, ...