Navitas Semiconductor has expanded its portfolio of SiCPAK power modules with new 1,200-V devices that feature epoxy-resin potting and proprietary trench-assisted planar SiC MOSFET technologies. These ...

‘These technologies enter the market without proper qualification,’ Gebhardt says. Image: Fraunhofer ISE This interview appears alongside others on module reliability in the latest edition of our ...

Damage to a relay contact after cyclic current loading. A better understanding of inverter reliability will help boost performance and reduce costs. Image: Fraunhofer IMWS. Inverters are critical to ...

Navitas Semiconductor has announced the launch of its new SiCPAK™ power modules, which utilize innovative epoxy-resin potting technology alongside proprietary trench-assisted planar SiC MOSFET ...

Power electronics underpin modern energy systems and transportation, making the reliability and thermal management of semiconductor modules a matter of global significance. The field is marked by ...

MALVERN, Pa., Dec. 03, 2025 (GLOBE NEWSWIRE) -- Vishay Intertechnology, Inc. (VSH) today introduced two new 1200 V MOSFET power modules designed to increase efficiency and reliability for medium to ...

TOKYO--(BUSINESS WIRE)--Mitsubishi Electric Corporation (TOKYO: 6503) announced today that it will begin developing a prototype to demonstrate a junction-temperature estimation technology for power ...

Texas Instruments revealed a family of isolated power modules based on its IsoShield multichip packaging technology, claiming 3X higher power density than discrete solutions in isolated power designs.

Over the past decade, the use of heat pipes in electronic cooling applications has increased dramatically, primarily in notebook computers. In fact, virtually every notebook computer manufactured ...

Will estimate junction temperature and related degradation of power modules In the global effort to expand the introduction of renewable energy to support carbon neutrality, the need to upgrade the ...