Printed Circuit Design & Fab Online Magazine

Rethinking the basics of PCB and IC Substrate manufacturing with mSAP

SAP enables AT&S to manufacture printed circuit boards and IC substrates of a size and complexity that almost rivals products from the semi-conductor industry. mSAP stands for “modified semi-additive ...
Taiwan News

Taiyo Holdings Launches Next-generation Semiconductor-packaging Material "FPIM (TM) Series," Its First Successful Formation of 3-layer RDL with CD 1.6 Micrometers on 12-inch Wafer

TOKYO, Nov. 13, 2025 /PRNewswire/ -- On November 13, 2025, Taiyo Holdings Co., Ltd. (Securities Code: 4626; hereinafter referred to as "Taiyo Holdings"), based in Tokyo, presented a paper, co-authored ...
manilatimes

SCHMID Group secures major orders for Panel Level Packaging (PLP) and modified-Semi-Additive (mSAP) production equipment

SCHMID Group secures Major Orders for AI Server PCB Production Equipment Freudenstadt, In one project, SCHMID will deliver a complete wet-process equipment setup featuring its advanced V+ and H+ ...
EDN

Dry film photoresist enables fine circuit formation

Asahi Kasei has developed the Sunfort TA series of dry film photoresist for next-generation semiconductor packages requiring circuit patterns with line/space widths of 2/2 µm or less. The film offers ...