OM Group has been providing plating solutions to the electronics industries for over 40 years. Through this experience, the Solar Chemicals division has developed a revolutionary Ni/Cu/Ag plating ...

Advanced packaging can be an alphabet soup of possible approaches, from heterogenous integration of multiple die types into a single package, to three-dimensional stacking of multiple dies on top of ...

Researchers from Pohang University of Science and Technology (POSTECH) and the University of Montpellier have successfully synthesized wafer-scale hexagonal boron nitride (hBN) exhibiting an ...

Every foundry and every node is different, but for every foundry/node there are multiple supported metal stacks. Some chips use a lot more metal layers than others. A common rule of thumb is each ...

To allow 32-nm generation high-k metal gate stacks using a single metal, instead of the two different metals required previously for CMOS, semiconductor manufacturing equipment maker ASM America Inc, ...