The patented CSP/BallNest Hybrid Socket enables prototyping, test, or burn-in of CSP, BGA, microBGA, and LGA devices. The socket features a lid that nests each ball termination for connection ...
Ironwood Electronics rolled out its B-LGA20A-Z-01 Socket Probe Adapter which allows high-speed testing of LGA device while accessing the signals using testers via header pins. Features of the ...
Intel's next-gen 'Johnson City' platform supports next-gen Xeon 'Diamond Rapids' CPUs with up to 650W TDP, offering up to a rumored 256-core CPUs.
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