Abstract: The flip chip, a type of chip mounting used in semiconductor devices, has become one of the most popular innovations in the semiconductor packaging industry. The height of flip-chip solder ...
Abstract: The test vehicle is the FCOB with the chip size of 4mm*4mm*0.52mm, 0.32mm pitch and an I/O array of 13*13. Different solder height and UBM height are considered. The analysis is performed by ...
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